Grounding Issues
May 7th, 2009 by Editor
Shielding against EMI emissions is commonly provided by a conductive enclosure. The separate parts of the enclosure must be electrically bonded together and grounded for the shielding to work. Disruptions in the electrical continuity between parts adversely affect shielding performance. Proper grounding of PCBs and shielding enclosure components is also a method for reducing board-generated EMI. However, improper or ineffective grounding may actually increase EMI emission levels, with the ground itself become a major radiating source. Many NEDC Fabricating Solutions shielding materials can be used for providing conductive grounding paths.