MIL-DTL-83528C
ELASTOMER TYPE (SHORE A) CHOMERICS LAIRD
A SIL AG/CU 65 1215 80
A SIL AG/CU 65 1250 80
B SIL AG/AL 65 1285 81
C FSIL AG/CU 75 1217 88
C FSIL AG/CU 75 1257 88
D FSIL AG/AL 70 1287 89
D FSIL AG/AL 70 1298 89
E SIL AG 65 1224 82
F FSIL AG 75 1221 99
G SIL AG/CU 80 1239 98
H SIL AG 80 97
J SIL AG 50 83
K SIL AG/CU 85 94
L SIL AG/NI 75 1278 84
M SIL AG/G 65 1350 85
M SIL AG/G 65 1358 85
These materials are [...]
Posted in Conductive Extrusions, Conductive Materials, Conductive Vent Panels, Die Cutting, EMI Shielding, EMI shielding Materials, EMI/RFI, Fabricating Solutions, Finger Stock Gaskets, Fingerstocks, Foil Film and Tapes, Form In Place Gasketing, Gasket Manufacturing, Insulator Materials, Laird Technologies, Leader Tech, Materials, Military Electronics, Naval and Aerospace Electronics, O-rings, Parker Chomerics, Plastic Machining, RFI Shielding, Rubber Manufacturing, Tecknit, Waterjet Cutting on August 28th, 2007 No Comments »
Posted in Bergquist, Conductive Extrusions, Conductive Materials, Conductive Vent Panels, Die Cutting, EMI Shielding, EMI shielding Materials, EMI/RFI, Fabricating Solutions, Finger Stock Gaskets, Fingerstocks, Foil Film and Tapes, Form In Place Gasketing, Gasket Manufacturing, Insulator Materials, Laird Technologies, Leader Tech, Materials, Military Electronics, Naval and Aerospace Electronics, O-rings, Parker Chomerics, RFI Shielding, Rubber Manufacturing, Tecknit, Waterjet Cutting on August 27th, 2007 No Comments »
Posted in Bergquist, Conductive Extrusions, Conductive Materials, Die Cutting, EMI Shielding, EMI shielding Materials, EMI/RFI, Fabricating Solutions, Finger Stock Gaskets, Fingerstocks, Foil Film and Tapes, Form In Place Gasketing, Gasket Manufacturing, Glass Cutting, Insulator Materials, Laird Technologies, Laser Cutting, Leader Tech, Materials, Metal Cutting, Military Electronics, Naval and Aerospace Electronics, O-rings, Parker Chomerics, Plastic Machining, RFI Shielding, Rubber Manufacturing, Tecknit, Waterjet Cutting on August 26th, 2007 No Comments »
Posted in Bergquist, Conductive Extrusions, Conductive Materials, Conductive Vent Panels, Die Cutting, EMI Shielding, EMI shielding Materials, EMI/RFI, Fabricating Solutions, Finger Stock Gaskets, Fingerstocks, Foil Film and Tapes, Form In Place Gasketing, Gasket Manufacturing, Insulator Materials, Laird Technologies, Laser Cutting, Leader Tech, Materials, Military Electronics, Naval and Aerospace Electronics, O-rings, Parker Chomerics, RFI Shielding, Rubber Manufacturing, Tecknit on August 26th, 2007 No Comments »
Posted in Bergquist, Conductive Extrusions, Conductive Materials, Conductive Vent Panels, Die Cutting, EMI Shielding, EMI shielding Materials, EMI/RFI, Fabricating Solutions, Finger Stock Gaskets, Fingerstocks, Foil Film and Tapes, Gasket Manufacturing, Insulator Materials, Laird Technologies, Laser Cutting, Leader Tech, Materials, Metal Cutting, Military Electronics, Naval and Aerospace Electronics, O-rings, Parker Chomerics, RFI Shielding, Tecknit on August 26th, 2007 No Comments »
Posted in Bergquist, Conductive Extrusions, Conductive Materials, Conductive Vent Panels, Die Cutting, EMI Shielding, EMI shielding Materials, EMI/RFI, Fabricating Solutions, Finger Stock Gaskets, Fingerstocks, Foil Film and Tapes, Form In Place Gasketing, Gasket Manufacturing, Laird Technologies, Laser Cutting, Leader Tech, Materials, Metal Cutting, Military Electronics, Naval and Aerospace Electronics, Parker Chomerics, RFI Shielding, Tecknit on August 25th, 2007 No Comments »
Posted in Bergquist, Conductive Extrusions, Conductive Materials, Conductive Vent Panels, Die Cutting, EMI Shielding, EMI shielding Materials, EMI/RFI, Fabricating Solutions, Finger Stock Gaskets, Fingerstocks, Foil Film and Tapes, Form In Place Gasketing, Gasket Manufacturing, Insulator Materials, Laird Technologies, Laser Cutting, Leader Tech, Materials, Military Electronics, Naval and Aerospace Electronics, O-rings, Parker Chomerics, RFI Shielding, Tecknit on August 21st, 2007 No Comments »
Posted in Conductive Extrusions, Conductive Materials, Conductive Vent Panels, Die Cutting, EMI Shielding, EMI shielding Materials, EMI/RFI, Fabricating Solutions, Finger Stock Gaskets, Fingerstocks, Foil Film and Tapes, Form In Place Gasketing, Gasket Manufacturing, Insulator Materials, Laird Technologies, Laser Cutting, Materials, Military Electronics, Naval and Aerospace Electronics, O-rings, Plastic Machining, RFI Shielding on August 18th, 2007 No Comments »