Cost Effective Solutions
Posted in Bergquist, Conductive Extrusions, Conductive Materials, Conductive Vent Panels, Die Cutting, EMI Shielding, EMI shielding Materials, EMI/RFI, Fabricating Solutions, Finger Stock Gaskets, Fingerstocks, Foil Film and Tapes, Form In Place Gasketing, Gasket Manufacturing, Insulator Materials, Laird Technologies, Leader Tech, Materials, Military Electronics, Naval and Aerospace Electronics, O-rings, Parker Chomerics, RFI Shielding, Rubber Manufacturing, Tecknit, Waterjet Cutting on August 27th, 2007 No Comments »
NEDC Fabricating Solutions can provide cost-effective solutions. We can provide fabric over foa m. This product is used in some of the following applications: Wireless handsets shielding and grounding of vent/air flow panels. We can supply conductive jacketing over foam. It also can be used in outdoor enclosures that provide shielding in EMI/RFI applications. NEDC [...]